Thermal Interface Materials & Solutions

Electrolube cartridge application gun, suitable for TCOR and TCER. Send enquiry

TCOR Thermally Conductive Oxime is a single component, high thermal conductivity RTV for the effective bonding or gap filling in electronic devices. Send enquiry

Thermal Bonding System is a two part epoxy bonding system which utilises metal oxides to provide excellent thermal conductivity whilst being electrically insulating. Send enquiry

HTSP provides the ultimate in thermal conductivity together with the very wide temperature range obtained by using silicone base oils. Send enquiry

Silicone Heat Transfer Compound is a metal oxide filled silicone oil providing an extremely efficient and exceptionally thermally conductive compound which will operate over a wide temperature range. Send enquiry

GF400 is a two part, liquid silicone based gap filler, which provides excellent thermal performance. Send enquiry

Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required. Send enquiry

HTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. Send enquiry