ALPHA NCX-PRL507 Solder Flux

ALPHA NCX-PRL507 is an epoxy paste flux for wafer level ball attach for both Fan-in and Fan-out applications. It can also be used as a flip chip flux for wafer level packaging.

  • Superior activity, wetting, and assembly yield rates
  • High Tg polymer reinforcement layer
  • Excellent material stability – maintains tack and viscosity over multiple print cycles