ALPHA Telecore HF-850 is our fastest wetting and lowest spattering, Halogen Free and Halide Free cored wire offering. ALPHA Telecore HF-850 is suitable for use in any electronic or industrial no-clean soldering application that specifies compliance to the IPC J-STD-004 ROL0 standard. It is ideal for electronic assemblies used in Automotive, Consumer Electronics, Computer and …
ALPHA EF-6808HF is a broad spectrum halogen-free, low solids, alcohol based, no-clean flux for use in a variety of automated and manual soldering applications. ALPHA EF-6808HF is a halogen-free, low solids, alcohol based, no-clean flux for use in a variety of automated and manual soldering applications. While effective on many types of assemblies, this flux …
A lead-free, no-clean solder paste designed to maximize flexibility in manufacturing and provide superior electrochemical reliability in the most challenging applications. ALPHA CVP-390V is a zero-halogen solder paste that exhibits best-in-class electrochemical reliability down to 0.100mm comb spacing against the most challenging SIR profiles. ALPHA CVP-390V’s compatibility with Innolot and ability to maintain high electrochemical …
No clean paste flux with high activity for a wide range of soldering applications. Good thermal stability, tack strength and high activity for excellent yield rates IPC-J-STD-004 compliant for long term electrical reliability Halide and halogen-free formulation Send enquiry
Water soluble paste flux for wafer level ball attach on both Fan-in and Fan-out applications. Excellent activity allows for excellent soldering to Cu UBM, Cu OSP and ENIG soldering process Excellent wettability: Excellent activity reduces the occurrence of dark balls Excellent cleanability: Flux residues are removed easily with warm DI water Send enquiry
Water soluble liquid flux for wafer level electroplated bump reform. Excellent activity allows for superior wetting, maximizing wetting and bump reforming Best adapted to bump forming process of lead free SAC alloys Excellent cleanability; residues are easily cleaned with DI water Send enquiry
ALPHA NCX-PRL507 is an epoxy paste flux for wafer level ball attach for both Fan-in and Fan-out applications. It can also be used as a flip chip flux for wafer level packaging. Superior activity, wetting, and assembly yield rates High Tg polymer reinforcement layer Excellent material stability – maintains tack and viscosity over multiple print …
ALPHA WS-630 is a water soluble high activity paste flux that delivers excellent solder wetting on challenging finishes and enables low voiding performance. Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process Superior wetting maximizing assembly yields to provide highest ball attach and flip chip yield rates Excellent cleanability performance in …
No clean paste flux which enables low residue post reflow with low voiding and excellent soldering performance. Good thermal stability, tack strength and high activity for excellent yield rates Ultra low residue post reflow; <10% by Wt IPC-J-STD-004 compliant for long term electrical reliability Send enquiry
ALPHA WS-608 is a water soluble high activity paste flux which delivers excellent solder wetting on challenging finishes, excellent cleaning and enables low voiding performance. Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process Superior wetting maximizing assembly yields to provide highest ball attach yield rates Excellent cleanability performance in that …
