Water soluble paste flux for wafer level ball attach on both Fan-in and Fan-out applications. Excellent activity allows for excellent soldering to Cu, Cu OSP and ENIG soldering process Excellent material stability – maintains viscosity tack and viscosity over time Wide process window for maximum application flexibility especially for wafer level ball attach Send enquiry
ALPHA WS-698 is a water soluble high activity paste flux which delivers excellent solder wetting on challenging finishes and enables low voiding performance. Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process Superior wetting maximizing assembly yields to provide highest ball attach and flip chip yield rates Excellent cleanability performance in …
High lead, zero-halogen, no clean solder paste designed for high power, high performance, die attach applications. Excellent voiding performance on die attach applications Excellent dispensing consistency High reliability die attach connection for high power semiconductor applications Send enquiry
No clean, lead-free solder paste which meets zero-halogen requirements with low voiding, fine feature printing performance. Excellent solder joint and flux residue cosmetics Excellent voiding performance Long stencil life: consistent performance for at least 8-hours of continuous printing Send enquiry
No-clean, lead-free solder paste that enables low residue post reflow with low voiding and excellent soldering performance. Almost “no residue” cosmetic appearance Excellent voiding performance Excellent print consistency with high process capability index across all board designs Send enquiry
Water soluble, lead-free solder paste which meets zero-halogen requirements with low voiding and excellent residue cleaning performance. Very low voiding performance Excellent solder joint and flux residue cleaning performance Robust tack force ensures high pick-and-place yields, good self-alignment Send enquiry
High activity water soluble Lead-Free solder paste capable of high soldering yields with low voiding and excellent residue cleaning performance Low voiding Performance Maximizes reflow yield for lead-free processing Excellent print consistency with high process capability index Send enquiry
Water soluble, lead-free solder paste capable of 50um aperture printing performance with low voiding and excellent soldering and residue cleaning performance. Low voiding performance Maximizes reflow yield for lead-free processing Excellent print consistency with high process capability index Send enquiry
